Wild, likely untrue rumour: Nintendo’s next console specs

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nintender

For many people, Nintendo’s Wii U is just not next-gen enough. Some (wrongly) believe it can’t even compare to the Ps3 and Xbox 360. If Nintendo wants to stay in the game, they need a system that can compete with the PS4 and Xbox One. They’re most likely busy with Research and Development on new systems right now. These are probably not the specs for those systems.

According to Nintendo News, these are the specs you’ll find in the follow-up to the 3DS and the Wii U. I don;t believe them for a second; they’re far too specific and read more like some Nintendo’’ fan’s wishlist. they’re still certainly worth talking about though. Apparently the “new consoles” will be backwards compatible with their forbears; so the Fusion DS will play 3DS Games, and the Terminal, which the Fusion links with, will ply Wii U games.

Take this all with a particularly large grain of salt, but as I said this is all too specific for something that’s probably only in basic R&D. The 3DS is only 3 years old, and the Wii U is less than two. This would alienate just about every remaining Nintendo fan in the world, cost Nintendo way too much money and just wouldn’t make sense right now. The 3DS is still incredibly successful, with time to get better still, and the Wii U has picked up a little steam over the holidays. Probably not enough steam for the console to be truly successful, but I just don’t see Nintendo abandoning the Wii U and the 3Ds for some time yet.

Fusion DS

  • CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
  • COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
  • 2 130 mm DVGA (960 x 640) Capacitive Touchscreen
  • Slide Out Design with Custom Swivel Tilt Hinge
  • Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
  • Low End Vibration for Gameplay and App Alerts
  • 2 Motorized Circle Pads for Haptic Feedback
  • Thumbprint Security Scanner with Pulse Sensing Feedback
  • 2 1mp Stereoptic Cameras
  • Multi-Array Microphone
  • A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
  • 3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
  • NFC Reader
  • 3G Chip with GPS Location
  • Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
  • 16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigabytes)
  • Nintendo 3DS Cart Slot
  • SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
  • Mini USB I/O
  • 3300 mAh Li-Ion battery

Fusion Terminal

  • GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
  • CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
  • Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
  • MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAMED KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
  • 802.11 b/g/n Wireless
  • Bluetooth v4.0 BLE
  • 2 USB 3.0
  • 1 Coaxial Cable Input
  • 1 CableCARD Slot
  • 4 Custom Stream-Interface Nodes up to 4 Wii U GamePads
  • Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot
  • 1 HDMI 2.0 1080p/4K Port
  • Dolby TrueHD 5.1 or 7.1 Surround Sound
  • Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
  • Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage

Last Updated: January 22, 2014

Geoffrey Tim

Editor. I'm old, grumpy and more than just a little cynical. One day, I found myself in possession of a NES, and a copy of Super Mario Bros 3. It was that game that made me realise that games were more than just toys to idly while away time - they were capable of being masterpieces. I'm here now, looking for more of those masterpieces.

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